Inventor · Hudson, NH, US

Mark Lefebvre

20Patents
7h-index
35Co-inventors
65Inventor score

Filing activity: May 17, 1999 → May 12, 2017

Most-cited inventions

PatentTitleAreaCited byStatus
US6444110B1 Electrolytic copper plating method Electricity 39 Expired
US6689711B2 Methods of producing oxygen reduction catalyst Emerging Cross-Sectional Technologies 23 Expired
US6531046B2 Seed layer repair method Electricity 17 Expired
US8048284B2 Metal plating compositions Electricity 16 Active
US6660153B2 Seed layer repair bath Electricity 10 Expired
US8012334B2 Metal plating compositions and methods Chemistry; Metallurgy 8 Active
US8329018B2 Metal plating compositions and methods Chemistry; Metallurgy 7 Active
US8337688B2 Metal plating compositions Electricity 7 Active
US6660154B2 Seed layer Electricity 5 Expired
US9932684B2 Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides Electricity 1 Active
US9809892B1 Indium electroplating compositions containing 1,10-phenanthroline compounds and methods of electroplating indium Chemistry; Metallurgy 1 Active
US8198120B2 Optical article Electricity 1 Active
US10100421B2 Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds Electricity 0 Active
US8716824B2 Article having electrically conductive and selectively passivated patterns Electricity 0 Active
US9809891B2 Plating method Electricity 0 Active
US10428436B2 Indium electroplating compositions containing amine compounds and methods of electroplating indium Chemistry; Metallurgy 0 Active
US8956523B2 Metal plating compositions and methods Chemistry; Metallurgy 0 Active
US10006136B2 Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds Electricity 0 Active
US9365943B2 Method of electroplating uniform copper layers Electricity 0 Active
US10104782B2 Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.