In die stepping sort
US10429439B2 · kind B2 · utility
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0References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 1, 2016 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Jan 30, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5386
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for testing a die can comprise a first printed circuit board (PCB), a space transformer, and a plurality of probes. The first PCB can be configured to connect to a second PCB. The space transformer can be attached to the PCB. The space transformer can include a plurality of traces. Each of the plurality of probes can be connected to one of the plurality of traces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.