Lift pin and method for manufacturing same
US10431488B2 · kind B2 · utility
1Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2016 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Jan 22, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lift pin passes through a hole of a susceptor on which a wafer is placed inside a process chamber in which an epitaxial process is performed with respect to the wafer, to support the wafer, and has a surface formed of a glassy carbon material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.