Semiconductor packages having dual encapsulation material
US10431514B2 · kind B2 · utility
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2References
18Claims
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Key dates
| Filing date | Nov 20, 2017 |
| Grant date | Oct 1, 2019 |
| Priority date | — |
| Expiry date | Nov 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One or more embodiments are directed to a semiconductor package that includes transparent encapsulation material and an opaque encapsulation material. In one embodiment, the opaque encapsulation material is thicker than the transparent encapsulation material; however, the outer surfaces of the opaque and the transparent encapsulation materials are coplanar with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.