Wafer level package for a MEMS sensor device and corresponding manufacturing process
US10435290B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2017 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Oct 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS device having a wafer-level package, is provided with: a stack of a first die and a second die, defining at least a first internal surface internal to the package and carrying at least an electrical contact pad, and at least a first external surface external to the package and defining a first outer face of the package; and a mold compound, at least in part coating the stack of the first and second dies and having a front surface defining at least part of a second outer face of the package, opposite to the first outer face. The MEMS device is further provided with: at least a vertical connection structure extending from the contact pad at the first internal surface towards the front surface of the mold compound; and at least an external connection element, electrically coupled to the vertical connection structure and exposed to the outside of the package, at the second outer face thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.