Wafer-level lens packaging methods, and associated lens assemblies and camera modules
US10437025B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2015 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Apr 5, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.