Method for prefixing of substrates
US10438822B2 · kind B2 · utility
3Cited by
8References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 6, 2019 |
| Grant date | Oct 8, 2019 |
| Priority date | — |
| Expiry date | Mar 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2021/60067
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and a device for prefixing substrates, whereby at least one substrate surface of the substrates is amorphized in at least one surface area, characterized in that the substrates are aligned and then make contact and are prefixed on the amorphized surface areas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.