Patent · US Active

Package with component connected with carrier via spacer particles

US10438878B2 · kind B2 · utility

1Cited by

0References

15Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Schindler · Borgo San Lazzaro, DE
Franz-Peter Kalz · Regensburg, DE
Volker Strutz · Tegernheim, DE

Key dates

Filing date	Apr 10, 2018
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Apr 10, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/19105
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package and method of making a package. In one example, the package includes an at least partially electrically conductive carrier, a passive component mounted on the carrier, and an at least partially electrically conductive connection structure electrically connecting the carrier with the component and comprising spacer particles configured for spacing the carrier with regard to the component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.