Patent · US Active

Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module

US10438924B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

DANFOSS SILICON POWER GMBH · DE

Inventors

Martin Becker · Kiel, DE
Ronald Eisele · Surendorf, DE
Frank Osterwald · Kiel, DE
Jacek Rudzki · Kiel, DE
Holger Ulrich · Nortorf, DE

Key dates

Filing date	Apr 28, 2017
Grant date	Oct 8, 2019
Priority date	—
Expiry date	Feb 3, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/8384
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor module by sintering, the method comprising the steps of: applying a layer of unsintered sinter material to a predetermined bonding surface of the first component, arranging the second component on the surface layer of unsintered sinter material, attaching the second component to the first component by applying pressure and/or temperature on a locally delimited partial area within the predetermined bonding surface, processing the first and/or second component and/or other components of the power semiconductor module, and complete-area sintering of the sinter material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.