Micromechanical system including a sensitive element and associated manufacturing method
US10442681B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 2, 2018 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Feb 2, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/032
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A micromechanical system including a sensitive element, the system including a first area in which the sensitive element is situated, and a second area which at least partially surrounds the first area. Furthermore, the system includes a holding element having an elastic property, which joins the first area to the second area, and a joining material, with the aid of which the second area may be joined to a substrate. A spacing area is provided between the first area and the second area. The joining material extends into the spacing area so that a possible movement of the first area caused by the elastic property of the holding element is limited.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.