Inventor · Metzingen, DE

Volkmar Senz

15Patents
2h-index
38Co-inventors
50Inventor score

Filing activity: Jul 21, 2005 → Mar 26, 2020

Most-cited inventions

PatentTitleAreaCited byStatus
US7647832B2 Micromechanical device and method for producing a micromechanical device Performing Operations; Transporting 2 Active
US11486782B2 Micromechanical device and method for manufacturing a micromechanical device Physics 2 Active
US11215509B2 Method for determining a temperature without contact, and infrared measuring system Physics 1 Active
US11441964B2 Micromechanical pressure sensor device and corresponding manufacturing method Performing Operations; Transporting 0 Active
US11933689B2 MEMS capacitive sensor including improved contact separation Physics 0 Active
US11976996B2 Micromechanical component for a capacitive pressure sensor device Performing Operations; Transporting 0 Active
US9923015B2 Infrared photosensor Electricity 0 Active
US9778323B2 Magnetic sensor device and manufacturing method for a magnetic sensor device Physics 0 Active
US12030773B2 Method for producing a wafer connection Performing Operations; Transporting 0 Active
US10442681B2 Micromechanical system including a sensitive element and associated manufacturing method Performing Operations; Transporting 0 Active
US11060937B2 Micromechanical pressure sensor Physics 0 Active
US9850120B2 Micromechanical component having a diaphragm Electricity 0 Active
US10816404B2 Method for determining a temperature without contact, and infrared measuring system Physics 0 Active
US7667282B2 Micromechanical component and method for manufacturing such a component Performing Operations; Transporting 0 Expired
US11940345B2 Micromechanical component for a capacitive pressure sensor device Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.