Galvanic signal path isolation in an encapsulated package using a photonic structure
US10444432B2 · kind B2 · utility
1Cited by
32References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2017 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Oct 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/123
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An encapsulated package is provided that includes a pair integrated circuit (IC) die. A radio frequency (RF) circuit on one of the IC die is operable to transmit an RF signal having a selected frequency. An RF circuit on the other IC die is operable to receive the RF signal Encapsulation material encapsulates the IC die. A photonic waveguide couples between the RF transmitter and RF receiver to form galvanic path isolation between the two IC die. The photonic waveguide is formed by a photonic structure within the encapsulation material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.