Packaging structure and fabrication method thereof

US10446474B2 · kind B2 · utility

Assignees

• Semiconductor Manufacturing International (Shanghai) Corporation · CN
• Semiconductor Manufacturing International (Beijing) Corporation · CN

Inventors

• Li Jin · Houston, US
• Li Hui Lu · Shanghai, CN
• Chun Chao Fei · Shanghai, CN
• Po Yuan Chiang · Shanghai, CN
• Ya Ping Wang · Shanghai, CN

Key dates

• Filing date: Dec 21, 2017
• Grant date: Oct 15, 2019
• Expiry date: Dec 21, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/1033
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A packaging structure and a method for fabricating the packaging structure are provided. The packaging structure includes a base substrate including a solder pad body region and a trench region adjacent to and around the solder pad body region. The packaging structure also includes a passivation layer on a surface of the base substrate and exposing the solder pad body region and the trench region. In addition, the packaging structure includes a main body solder pad on the solder pad body region of the base substrate, and one or more trenches on the trench region of the base substrate and between the passivation layer and the main body solder pad. Further, the packaging structure includes a bonding conductive wire having one end connected to the main body solder pad.