Ya Ping Wang
9Patents
2h-index
19Co-inventors
44Inventor score
Filing activity: Dec 4, 2006 → Nov 30, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8037918B2 | Pick-up heads and systems for die bonding and related applications | Emerging Cross-Sectional Technologies | 7 | Active |
| US7989941B2 | Integrated circuit package system with support structure for die overhang | Electricity | 6 | Active |
| US8035336B2 | Charger slipcover and handheld device | Electricity | 0 | Active |
| US11335648B2 | Semiconductor chip fabrication and packaging methods thereof | Electricity | 0 | Active |
| US10950525B2 | Fabrication method of packaging structure | Electricity | 0 | Active |
| US12398454B2 | Fixed-position defect doping method for micro-nanostructure, and NV center sensor | Chemistry; Metallurgy | 0 | Active |
| US11320951B1 | Transparent conductive electrode of touch panel | Physics | 0 | Active |
| US10522479B2 | Semiconductor chip, and fabrication and packaging methods thereof | Electricity | 0 | Active |
| US10446474B2 | Packaging structure and fabrication method thereof | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.