Offset interposers for large-bottom packages and large-die package-on-package structures
US10446530B2 · kind B2 · utility
4Cited by
10References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 16, 2011 |
| Grant date | Oct 15, 2019 |
| Priority date | — |
| Expiry date | Jan 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respective two land-side BGA pads through the offset interposer. The land-side BGA is configured to interface with a first-level interconnect. The POP-side BGA is configured to interface with a POP substrate. Each of the two land-side pads has a different footprint than the respective two POP-side pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.