Resin, composition, cured film, method for manufacturing cured film and semiconductor device
US10450417B2 · kind B2 · utility
2Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2018 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Mar 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Provided is a resin capable of yielding a cured film with less warp and good uniformity, and of yielding a cured film (pattern) with less scum; a composition using the resin; a cured film; and a method for manufacturing a cured film and a semiconductor device. The resin is selected from polyimide precursor, polyimide, polybenzoxazole precursor, and, polybenzoxazole, and has a polymerizable group, and has a total content of a component with a molecular weight of 1,000 or smaller of 0.005 to 1.0% by mass.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.