Wafer-level methods for packing camera modules, and associated camera modules
US10455131B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2015 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Nov 4, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wafer-level method for packaging a plurality of camera modules includes (a) overmolding a first housing material around a plurality of image sensors to produce a first wafer of packaged image sensors, (b) seating a plurality of lens units in the first wafer above the plurality of image sensors, respectively, and (d) overmolding a second housing material over the first wafer and around the lens units to form a second wafer of packaged camera modules, wherein each of the packaged camera modules includes one of the image sensors and one of the lens units, and the second housing material cooperates with the first housing material to secure the lens units in the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.