MEMS transducer package
US10455309B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2015 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | Jun 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2410/07
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS transducer package (1) comprises a semiconductor die element (3) and a cap element (23). The semiconductor die element (3) and cap element (23) have mating surfaces (9, 21). The semiconductor die element (3) and cap element (23) are configured such that when the semiconductor die element (3) and cap element (4) are conjoined, a first volume (7, 27) is formed through the semiconductor die element (3) and into the semiconductor cap element (23), and an acoustic channel is formed to provide an opening between a non-mating surface (11) of the semiconductor die element (3) and either a side surface (10, 12) of the transducer package or a non-mating surface (29) of the cap element (23).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.