Electronic device, socket, and spacer to alter socket profile

US10455685B1 · kind B1 · utility

Assignee

• Intel Corporation · US

Inventors

• Steven A. Klein · Chandler, US
• Kuang Liu · Queen Creek, US
• Thomas A. Boyd
• Luis Gil Rangel · Hillsboro, US
• Muffadal Mukadem · Portland, US
• Shelby Ferguson · Winters, US
• Francis Toth, Jr. · Cornelius, US
• Eric W. Buddrius · Hillsboro, US
• Ralph V. Miele · Hillsboro, US
• Sriram Srinivasan · Sammamish, US
• Jeffory L. Smalley · East Olympia, US

Key dates

• Filing date: Oct 15, 2018
• Grant date: Oct 22, 2019
• Expiry date: Oct 15, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/10325
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic device may include a circuit board, and the circuit board may include a dielectric material. A socket may be coupled to a first side of the circuit board, and the socket may be configured to receive a semiconductor package. A backing plate may be positioned on a second side of the circuit board. A spacer may be positioned between the backing plate and the circuit board. The spacer may alter the profile of the socket to provide a curved profile to the socket. The spacer may displace a portion of the socket in a first direction, for instance when the spacer is coupled between the backing plate and the circuit board.