Inventor · Hillsboro, OR, US

Eric W. Buddrius

13Patents
3h-index
38Co-inventors
56Inventor score

Filing activity: Jun 27, 2012 → Sep 14, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9257364B2 Integrated heat spreader that maximizes heat transfer from a multi-chip package Emerging Cross-Sectional Technologies 23 Active
US9646910B2 Integrated heat spreader that maximizes heat transfer from a multi-chip package Emerging Cross-Sectional Technologies 7 Active
US10455685B1 Electronic device, socket, and spacer to alter socket profile Electricity 6 Active
US9825387B2 Linear edge connector with a cable retention mechanism having a body with a groove with an indentation to receive a bolster plate protrusion Electricity 3 Active
US11449111B2 Scalable, high load, low stiffness, and small footprint loading mechanism Electricity 2 Active
US11291115B2 Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets Electricity 1 Active
US12279395B2 Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retention Electricity 0 Active
US11818832B2 Socket load regulation utilizing CPU carriers with shim components Electricity 0 Active
US11387163B2 Scalable debris-free socket loading mechanism Electricity 0 Active
US12176643B2 Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation Electricity 0 Active
US10680367B2 Cable retention assemblies including torsional elements Electricity 0 Active
US11557529B2 Mechanism combining fastener captivation and assembly tilt control for microprocessor thermal solutions Electricity 0 Active
US12315780B2 Technologies for processor loading mechanisms Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.