Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board
US10455703B2 · kind B2 · utility
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1References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 20, 2015 |
| Grant date | Oct 22, 2019 |
| Priority date | — |
| Expiry date | May 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing a printed circuit board (10) having at least one embedded sensor chip (3), in which at least one sensor face (5) and terminals (4) are arranged on a face of the chip, said method comprising the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.