Gerald Weidinger
25Patents
3h-index
24Co-inventors
59Inventor score
Filing activity: Jan 30, 2008 → Jul 24, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10665526B2 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Emerging Cross-Sectional Technologies | 5 | Active |
| US10187997B2 | Method for making contact with a component embedded in a printed circuit board | Electricity | 4 | Active |
| US9253888B2 | Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate product | Emerging Cross-Sectional Technologies | 3 | Active |
| US8685196B2 | Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method | Emerging Cross-Sectional Technologies | 2 | Active |
| US8388792B2 | Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor | Emerging Cross-Sectional Technologies | 2 | Active |
| US11523520B2 | Method for making contact with a component embedded in a printed circuit board | Electricity | 1 | Active |
| US8541689B2 | Method for removing a part of a planar material layer and multilayer structure | Emerging Cross-Sectional Technologies | 1 | Active |
| US10867888B2 | Component carrier comprising at least one heat pipe and method for producing said component carrier | Emerging Cross-Sectional Technologies | 0 | Active |
| US12185478B2 | Printed circuit board having embedded component | Electricity | 0 | Active |
| US10709023B2 | Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate | Electricity | 0 | Active |
| US9967972B2 | Circuit board having an asymmetric layer structure | Electricity | 0 | Active |
| US11792932B2 | Component carrier with embedded magnetic inlay and integrated coil structure | Electricity | 0 | Active |
| US11049778B2 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Electricity | 0 | Active |
| US12400968B2 | Component with dielectric layer for embedding in component carrier | Electricity | 0 | Active |
| US10051747B2 | Method for the production of a circuit board involving the removal of a subregion thereof | Emerging Cross-Sectional Technologies | 0 | Active |
| US11171092B2 | Component with dielectric layer for embedding in component carrier | Electricity | 0 | Active |
| US11889629B2 | Component carrier comprising embedded magnet stack | Electricity | 0 | Active |
| US10455703B2 | Method for producing a printed circuit board with an embedded sensor chip, and printed circuit board | Electricity | 0 | Active |
| US10861636B2 | Inductor made of component carrier material comprising electrically conductive plate structures | Electricity | 0 | Active |
| US11749613B2 | Component with dielectric layer for embedding in component carrier | Electricity | 0 | Active |
| US12002614B2 | Inductor made of component carrier material comprising electrically conductive plate structures | Electricity | 0 | Active |
| US10993313B2 | Non-uniform magnetic foil embedded in component carrier | Electricity | 0 | Active |
| US10306750B2 | Circuit board and method for manufacturing a circuit board | Electricity | 0 | Active |
| US12112888B2 | Component carrier with cavity accommodating at least part of driven body being magnetically drivable to move | Electricity | 0 | Active |
| US11749573B2 | Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavity | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.