Systems and methods for producing anti-wetting structures on metallic surfaces
US10458037B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Oct 27, 2016 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Jul 19, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25F3/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An exemplary embodiment of the present invention provides a method for anti-wetting metallic surfaces. A metallic object is introduced to an electrochemical solution. A cathode is introduced to the electrochemical solution, and an anode is attached to the metallic object. An electric potential between the cathode and anode is applied, such that selective electrochemical etching of the surface of the metallic object occurs. The selective etching etches grain boundaries at the surface of the metallic object, and the grain boundaries define grain faces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.