Conformal thermal ground planes
US10458716B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 4, 2014 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Mar 27, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23P2700/09
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A conformal thermal ground plane is disclosed according to some embodiments along with a method of manufacturing a conformal thermal ground plane according to other embodiments. The method may include forming a first planar containment layer into a first non-planar containment layer having a first non-planar shape; forming a second planar containment layer into a second non-planar containment layer having a second non-planar shape; disposing a liquid cavity and a vapor cavity between the first non-planar containment layer and the second non-planar containment layer; sealing at least a portion of the first non-planar containment layer and at least a portion of the second non-planar containment layer; and charging at least the liquid cavity with a working fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.