Yung-Cheng Lee
23Patents
9h-index
31Co-inventors
75Inventor score
Filing activity: May 10, 1990 → Jan 2, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5497258A | Spatial light modulator including a VLSI chip and using solder for horizontal and vertical component positioning | Physics | 55 | Expired |
| US5049982A | Article comprising a stacked array of electronic subassemblies | Electricity | 46 | Expired |
| US7426067B1 | Atomic layer deposition on micro-mechanical devices | Emerging Cross-Sectional Technologies | 25 | Expired |
| US9909814B2 | Flexible thermal ground plane and manufacturing the same | Emerging Cross-Sectional Technologies | 15 | Active |
| US11598594B2 | Micropillar-enabled thermal ground plane | Electricity | 15 | Active |
| US9651312B2 | Flexible thermal ground plane and manufacturing the same | Emerging Cross-Sectional Technologies | 15 | Active |
| US9921004B2 | Polymer-based microfabricated thermal ground plane | Performing Operations; Transporting | 12 | Active |
| US9163883B2 | Flexible thermal ground plane and manufacturing the same | Emerging Cross-Sectional Technologies | 10 | Active |
| US10458716B2 | Conformal thermal ground planes | Performing Operations; Transporting | 9 | Active |
| US10446466B1 | Mechanically improved microelectronic thermal interface structure for low die stress | Electricity | 7 | Active |
| US10571200B2 | Thermal ground plane | Emerging Cross-Sectional Technologies | 5 | Active |
| US10527358B2 | Thermal ground plane | Emerging Cross-Sectional Technologies | 5 | Active |
| US11306983B2 | Single and multi-layer mesh structures for enhanced thermal transport | Electricity | 2 | Active |
| US10724804B2 | Method and device for spreading high heat fluxes in thermal ground planes | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US11511377B2 | Conformal thermal ground planes | Performing Operations; Transporting | 1 | Active |
| US11988453B2 | Thermal management planes | Electricity | 1 | Active |
| US12104856B2 | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems | Performing Operations; Transporting | 1 | Active |
| US10731925B2 | Micropillar-enabled thermal ground plane | Electricity | 1 | Active |
| US11930621B2 | Folding thermal ground plane | Electricity | 0 | Active |
| US11898807B2 | Single and multi-layer mesh structures for enhanced thermal transport | Electricity | 0 | Active |
| US11353269B2 | Thermal ground plane | Emerging Cross-Sectional Technologies | 0 | Active |
| US12188732B2 | Single and multi-layer mesh structures for enhanced thermal transport | Electricity | 0 | Active |
| US12385697B2 | Micropillar-enabled thermal ground plane | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.