Substrate transfer device and substrate transfer method
US10460976B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2017 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Jun 6, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB25J11/0095
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Generation of dust from a peripheral portion of a substrate can be suppressed, and a processed substrate can be suppressed from being adversely affected by a pre-processed substrate. Further, an actual elevation state of the member configured to be moved up and down to support the substrate can be investigated. A substrate transfer device includes a first supporting portion, a second supporting portion and an elevating mechanism. The first supporting portion and the second supporting portion are configured to support a substrate from below the substrate. The elevating mechanism is configured to elevate the second supporting portion up and down between a first position higher than a height of the first supporting portion and a second position lower than the height of the first supporting portion. The substrate transfer device further includes a detecting mechanism configured to detect an elevation state of the second supporting portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.