Method of manufacturing an electromagnetic shield
US10461043B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2018 |
| Grant date | Oct 29, 2019 |
| Priority date | — |
| Expiry date | Aug 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides electromagnetic shielding for integrated circuit (IC) modules. First, a precursor package with a number of IC modules is provided. The precursor package is then placed onto a chemical resistant tape. After a sweller process and a desmear process are performed, the chemical resistant tape is removed. Next, the precursor package is singulated to form a number of individual IC modules. The individual IC modules are placed onto a carrier tape, such that a bottom surface of each individual IC module is covered by the carrier tape, and a top surface and side surfaces of each individual IC module are exposed. A shielding structure is applied completely over the top surface and the side surfaces of each individual IC module. Herein, the shielding structure is electrically coupled to a ground plane within each individual IC module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.