Stephen Parker
19Patents
6h-index
14Co-inventors
59Inventor score
Filing activity: Dec 7, 2007 → Oct 7, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9613831B2 | Encapsulated dies with enhanced thermal performance | Electricity | 201 | Active |
| US8186048B2 | Conformal shielding process using process gases | Emerging Cross-Sectional Technologies | 14 | Active |
| US9960145B2 | Flip chip module with enhanced properties | Electricity | 13 | Active |
| US8720051B2 | Conformal shielding process using process gases | Emerging Cross-Sectional Technologies | 10 | Active |
| US8959762B2 | Method of manufacturing an electronic module | Emerging Cross-Sectional Technologies | 9 | Active |
| US9661739B2 | Electronic modules having grounded electromagnetic shields | Emerging Cross-Sectional Technologies | 6 | Active |
| US10020206B2 | Encapsulated dies with enhanced thermal performance | Electricity | 1 | Active |
| US9899350B2 | Flip chip module with enhanced properties | General | 0 | Revoked |
| US9929125B2 | Flip chip module with enhanced properties | General | 0 | Revoked |
| US10811364B2 | Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation | Electricity | 0 | Active |
| US9929024B2 | Encapsulated dies with enhanced thermal performance | General | 0 | Revoked |
| US9576822B2 | Encapsulated dies with enhanced thermal performance | General | 0 | Revoked |
| US9859132B2 | Encapsulated dies with enhanced thermal performance | General | 0 | Revoked |
| US11596058B2 | Fiducials for laminate structures | Electricity | 0 | Active |
| US11387190B2 | Shielded electronic modules and methods of forming the same utilizing plating and double-cut singulation | Electricity | 0 | Active |
| US9892937B2 | Encapsulated dies with enhanced thermal performance | General | 0 | Revoked |
| US10461043B1 | Method of manufacturing an electromagnetic shield | Electricity | 0 | Active |
| US9960054B2 | Encapsulated dies with enhanced thermal performance | General | 0 | Revoked |
| US9997376B2 | Encapsulated dies with enhanced thermal performance | General | 0 | Revoked |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.