Power sensor for integrated circuits

US10466339B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Jonas Kammerer · Unterhaching, DE
• Herbert Knapp · Munich, DE
• Hao Li · Poing, DE

Key dates

• Filing date: Nov 12, 2018
• Grant date: Nov 5, 2019
• Expiry date: Nov 12, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H04B17/14
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.