Method for synchronous wet etching processing of differential microstructures

US10468265B1 · kind B1 · utility

Assignee

• GUANGDONG UNIVERSITY OF TECHNOLOGY · CN

Inventors

• Xin Chen · Tangxia, CN
• Yun Chen · 流花街道, CN
• Dachuang Shi · 流花街道, CN
• Xun Chen · Tangxia, CN
• Qiang Liu · Lo Wu, CN
• Jian Gao · Singapore, SG
• Chengqiang CUI · Tangxia, CN

Key dates

• Filing date: Apr 15, 2019
• Grant date: Nov 5, 2019
• Expiry date: Apr 15, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3083
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for synchronous wet etching processing of differential microstructures, including the following steps: step a: performing photoetching on a processing surface of a workpiece to be processed to develop the workpiece; step b: affixing a mask to a surface opposite to the processing surface of the workpiece; step c: continuously cooling the mask; step d: placing the cooled mask and the workpiece in a wet etching device; and adding an etchant to the processing surface of the workpiece to start etching; step e: removing the mask and the workpiece from the wet etching device after the set etching time; separating the mask and the workpiece to obtain a workpiece with a etching structure. A temperature difference is formed between the pattern area to be processed and the retaining area.