Patent · US Active

Semiconductor package assembly

US10468341B2 · kind B2 · utility

0Cited by

3References

28Claims

0Family size

Assignee

MEDIATEK INC. · TW

Inventors

Nai-Wei Liu
Tzu-Hung Lin · Hsinchu, TW
I-Hsuan Peng · Hsinchu, TW
Che-Hung Kuo · Hsinchu, TW
Che-Ya Chou
Wei-Che Huang · Hengshan, TW

Key dates

Filing date	Dec 26, 2018
Grant date	Nov 5, 2019
Priority date	—
Expiry date	Dec 26, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3512
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package assembly includes a redistribution layer (RDL) structure, which RDL structure includes a conductive trace. A redistribution layer (RDL) contact pad is electrically coupled to the conductive trace, and the RDL contact pad is composed of a symmetrical portion and an extended wing portion connected to the symmetrical portion. The RDL structure includes a first region for a semiconductor die to be disposed thereon and a second region surrounding the first region, and the extended wing portion of the RDL contact pad is offset from a center of the first region.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.