Inventor · Hsinchu, TW

Che-Hung Kuo

17Patents

2h-index

18Co-inventors

43Inventor score

Filing activity: Feb 1, 2016 → Jun 6, 2023

Most-cited inventions

Patent	Title	Area	Cited by	Status
US10847869B2	Semiconductor package having discrete antenna device	Electricity	7	Active
US10636773B2	Semiconductor package structure and method for forming the same	Electricity	6	Active
US9818727B2	Semiconductor package assembly with passive device	Electricity	1	Active
US11710688B2	Semiconductor package structure	Electricity	1	Active
US11776899B2	Via array design for multi-layer redistribution circuit structure	Electricity	0	Active
US10199318B2	Semiconductor package assembly	Electricity	0	Active
US12300679B2	Semiconductor package structure	Electricity	0	Active
US11887976B2	Land-side silicon capacitor design and semiconductor package using the same	Electricity	0	Active
US12021013B2	Ball pad design for semiconductor packages	Electricity	0	Active
US11908767B2	Semiconductor package structure	Electricity	0	Active
US10497678B2	Semiconductor package assembly with passive device	Electricity	0	Active
US12165961B2	Semiconductor package structure	Electricity	0	Active
US12230622B2	Electronic device with stacked printed circuit boards	Electricity	0	Active
US10468341B2	Semiconductor package assembly	Electricity	0	Active
US11908759B2	Semiconductor device	Electricity	0	Active
US12230560B2	Semiconductor package structure	Electricity	0	Active
US11721882B2	Semiconductor package having discrete antenna device	Electricity	0	Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.