Chiplets with connection posts
US10468363B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2015 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Aug 10, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A component includes a plurality of electrical connections on a process side opposed to a back side of the component. Each electrical connection includes an electrically conductive multi-layer connection post protruding from the process side. A printed structure includes a destination substrate and one or more components. The destination substrate has two or more electrical contacts and each connection post is in contact with, extends into, or extends through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. The connection posts or electrical contacts are deformed. Two or more connection posts can be electrically connected to a common electrical contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.