Carl Prevatte
46Patents
14h-index
12Co-inventors
70Inventor score
Filing activity: May 15, 2015 → Nov 13, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9520537B2 | Micro assembled LED displays and lighting elements | Electricity | 231 | Active |
| US9640715B2 | Printable inorganic semiconductor structures | Electricity | 135 | Active |
| US9437782B2 | Micro assembled LED displays and lighting elements | Electricity | 96 | Active |
| US9444015B2 | Micro assembled LED displays and lighting elements | Electricity | 90 | Active |
| US9698308B2 | Micro assembled LED displays and lighting elements | Electricity | 65 | Active |
| US9705042B2 | Micro assembled LED displays and lighting elements | Electricity | 63 | Active |
| US10224460B2 | Micro assembled LED displays and lighting elements | Electricity | 57 | Active |
| US10103069B2 | Pressure-activated electrical interconnection by micro-transfer printing | Electricity | 47 | Active |
| US10153256B2 | Micro-transfer printable electronic component | Electricity | 46 | Active |
| US10446719B2 | Micro assembled LED displays and lighting elements | Electricity | 28 | Active |
| US10468363B2 | Chiplets with connection posts | Emerging Cross-Sectional Technologies | 28 | Active |
| US10985143B2 | Micro assembled LED displays and lighting elements | Electricity | 27 | Active |
| US9991423B2 | Micro assembled LED displays and lighting elements | Electricity | 26 | Active |
| US10833225B2 | Micro assembled LED displays and lighting elements | Electricity | 21 | Active |
| US10475876B2 | Devices with a single metal layer | Electricity | 13 | Active |
| US10224231B2 | Micro-transfer-printable flip-chip structures and methods | Electricity | 13 | Active |
| US10153257B2 | Micro-printed display | Electricity | 13 | Active |
| US9799794B2 | Printable inorganic semiconductor structures | Electricity | 9 | Active |
| US10395966B2 | Micro-transfer-printable flip-chip structures and methods | Electricity | 9 | Active |
| US10600671B2 | Micro-transfer-printable flip-chip structures and methods | Electricity | 9 | Active |
| US10796971B2 | Pressure-activated electrical interconnection with additive repair | Electricity | 7 | Active |
| US11024608B2 | Structures and methods for electrical connection of micro-devices and substrates | Electricity | 6 | Active |
| US10832935B2 | Multi-level micro-device tethers | Electricity | 5 | Active |
| US10222698B2 | Chiplets with wicking posts | Emerging Cross-Sectional Technologies | 5 | Active |
| US10431487B2 | Micro-transfer-printable flip-chip structures and methods | Electricity | 4 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.