Plating method
US10468364B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Mar 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13147
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A plating method which can achieve a desired dome height is disclosed. The method includes: preparing correlation data showing a relationship between proportion of dome height to bump height and concentration of chloride ions; producing a plating solution containing chloride ions at a concentration which has been selected based on a desired proportion of dome height to bump height and on the correlation data, the selected concentration being in a range of 100 mg/dm3 to 300 mg/dm3; immersing a substrate in the plating solution; and passing an electric current between an anode and the substrate, both immersed in the plating solution, thereby plating the substrate to form bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.