Method of manufacturing a LED-based emissive display device
US10468452B2 · kind B2 · utility
1Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2018 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | May 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing elementary chips of a LED-based emissive display device, each chip including an inorganic semiconductor LED, a circuit for controlling the LED, and a plurality of areas of connection to an external device arranged on a connection surface of the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.