Camera module having baffle between two glass substrates
US10469718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 3, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | May 3, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/555
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.