MEMS transducer package
US10469956B2 · kind B2 · utility
0Cited by
2References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Nov 5, 2019 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A MEMS transducer package comprising a substrate; a filter circuit for filtering RF signals, the filter circuit comprising a resistor and a capacitor; and an IPD chip; wherein at least a portion of the filter circuit is provided within the IPD chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.