CMP pad conditioning assembly
US10471567B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2016 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Sep 15, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical planarization (CMP) pad conditioning assembly that includes one or more support structures positioned between one or more abrasive regions of the pad conditioning assembly is disclosed. The support structures and abrasive regions can be separated by one or more channels. A top surface of the one or more support structures is not co-planar with the top surface of the abrasive regions of the pad conditioning assembly, and the height of the top surface of the one or more support structures when measured to the pad facing surface of the pad conditioning assembly backing plate is less than the height of the top surfaces of the abrasive regions when measured to the pad facing surface of the pad conditioning assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.