Assembly and packaging of MEMS device
US10472231B2 · kind B2 · utility
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Key dates
| Filing date | Oct 27, 2016 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Jun 29, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0792
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A Micro Electro Mechanical systems (MEMS) device includes a solder bump on a substrate, a CMOS-MEMS die comprising a CMOS die and a MEMS die, and stud bumps on the CMOS die. The MEMS die is disposed between the CMOS die and the substrate. The stud bumps and the solder bumps are positioned to provide an electrical connection between the CMOS die and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.