Haijun She
3Patents
1h-index
3Co-inventors
30Inventor score
Filing activity: Jul 24, 2013 → Dec 15, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9508663B2 | Assembly and packaging of MEMS device | Performing Operations; Transporting | 2 | Active |
| US10655896B2 | Temperature stabilizing enclosure | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10472231B2 | Assembly and packaging of MEMS device | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.