Temperature-controlled gas supply line with dilution gas flows supplied at multiple locations
US10472718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2015 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Oct 16, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A device and a method for depositing organic layers onto a substrate includes a process gas source with a temperature-controlled evaporator, and a carrier gas supply line which opens into the evaporator in order to supply a carrier gas flow into a temperature-controlled first transport line. A first dilution gas supply line, which opens into the first transport line, supplies a dilution gas flow into the first transport line. The device also comprises a temperature-controlled gas inlet element fluidly connected to the first transport line. A gaseous starting material can be supplied into a processing chamber via the gas inlet element. A substrate is disposed on a temperature-controlled susceptor located in the processing chamber, and a layer is grown on the substrate using the gaseous starting material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.