Patent · US Active

Temperature-controlled gas supply line with dilution gas flows supplied at multiple locations

US10472718B2 · kind B2 · utility

0Cited by
2References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 1, 2015
Grant dateNov 12, 2019
Priority date
Expiry dateOct 16, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/52
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A device and a method for depositing organic layers onto a substrate includes a process gas source with a temperature-controlled evaporator, and a carrier gas supply line which opens into the evaporator in order to supply a carrier gas flow into a temperature-controlled first transport line. A first dilution gas supply line, which opens into the first transport line, supplies a dilution gas flow into the first transport line. The device also comprises a temperature-controlled gas inlet element fluidly connected to the first transport line. A gaseous starting material can be supplied into a processing chamber via the gas inlet element. A substrate is disposed on a temperature-controlled susceptor located in the processing chamber, and a layer is grown on the substrate using the gaseous starting material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.