Patent · US Active

Fully integrated avalanche photodiode receiver

US10473853B2 · kind B2 · utility

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19Claims
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Assignee

Inventors

Key dates

Filing dateDec 21, 2017
Grant dateNov 12, 2019
Priority date
Expiry dateDec 21, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/68
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

Various embodiments of a fully integrated avalanche photodiode receiver and manufacturing method thereof are described herein. A photonic device includes a silicon-on-insulator (SOI) substrate with a buried oxide (BOX) layer therein, an avalanche photodiode integrated with the SOI substrate, a capacitor integrated with the SOI substrate, a resistor integrated with the SOI substrate, and silicon passive waveguides as well as bonding pads integrated with the SOI substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.