Inspection device for inspecting wafer and method of inspecting wafer using the same
US10474133B2 · kind B2 · utility
2Cited by
7References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 4, 2017 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Dec 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An inspection device includes a first processor, a second processor, and a server. The first processor detects first coordinates of first feature points from first images in a first image set. The second processor detects second coordinates of second feature points from second images in a second image set. The server generates reference coordinates based on the first coordinates and the second coordinates. The reference coordinates are transmitted to the first processor and the second processor. The first and second image sets correspond to scanned swaths on a wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.