Virtual hierarchical layer usage
US10474781B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2015 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Feb 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Layout simulation and verification of a semiconductor chip can require extensive design rule checking (DRC) and design rules for manufacturing (DRM) analysis of the design in order to ensure proper operation. DRC and DRM can be expensive in terms of computational time and resource usage. To mitigate some of the cost, a virtual layer can be constructed for a cell instance identified in the semiconductor design. Shapes including rectangles and polygons can be determined which traverse the cell instance and are from other hierarchical layers of the design. The shapes can be combined to generate a virtual layer used for simulation, validation, DRC, DRM, etc. The virtual layer can be augmented with traversing shape information from other instances of the cell. The rectangles, polygons, and complex polygons can be combined to simplify the virtual layer. Multiple virtual layers can be generated for the simulation and validation processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.