Semiconductor device with an electrically-coupled protection mechanism and associated systems, devices, and methods
US10475771B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2018 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Jan 24, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first die; a first metal enclosure directly contacting and vertically extending below the first die, wherein the first metal enclosure peripherally encircles a first enclosed space; a second die directly contacting the first metal enclosure opposite the first die; a second metal enclosure directly contacting and vertically extending below the second die, wherein the second metal enclosure peripherally encircles a second enclosed space; and an enclosure connection mechanism directly contacting the first metal enclosure and the second metal enclosure for electrically coupling the first metal enclosure and the second metal enclosure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.