Optoelectronic semiconductor chip

US10475961B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Werner Bergbauer · Windberg, DE
• Joachim Hertkorn · Neukirchen, DE

Key dates

• Filing date: Jul 18, 2017
• Grant date: Nov 12, 2019
• Expiry date: Jul 18, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/825

Abstract

An optoelectronic semiconductor chip is disclosed. In an embodiment an optoelectronic semiconductor chip includes a semiconductor layer sequence composed of AlInGaN comprising an n-conducting n-region, a p-conducting p-region and an intermediate active zone having at least one quantum well for generating a radiation, wherein the p-region comprises an electron barrier layer, a contact layer and an intermediate decomposition stop layer, the contact layer being directly adjacent to a contact metallization, wherein the decomposition stop layer comprises an aluminum content of at least 5% and at most 30% in places, wherein an intermediate region arranged between the electron barrier layer and the decomposition stop layer has a thickness between 2 nm and 15 nm inclusive, the intermediate region being free of aluminum, and wherein the aluminum content in the decomposition stop layer varies and increases on average in a direction towards the contact layer.