Light emitting device package
US10475973B2 · kind B2 · utility
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1References
6Claims
0Family size
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Key dates
| Filing date | Jun 5, 2017 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
A packaged light emitting device die 20 includes a package body having a profiled leadframe 10 embedded in a body 12 of reflecting material. The leadframe 10 is exposed on mounting surface 14 only on at least one solder bonding area 16. Solder 22 is present only on the at least one solder bonding area 16 and not elsewhere. The reflecting material provides the reflecting parts of the package so there is no need for a reflective layer to be deposited on leadframe 10. Moreover, the reflecting material can function as a solder resist to self-align the solder 22 to the at least one solder bonding area 16.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.