Paul Dijkstra
14Patents
5h-index
24Co-inventors
62Inventor score
Filing activity: Apr 10, 2003 → Jun 5, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8183682B2 | Methods of packaging a semiconductor die and package formed by the methods | Emerging Cross-Sectional Technologies | 36 | Active |
| US7247938B2 | Carrier, method of manufacturing a carrier and an electronic device | Electricity | 23 | Expired |
| US10501342B2 | UV-C water purification device | Electricity | 6 | Active |
| US8159826B2 | Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments | Electricity | 6 | Active |
| US7944062B2 | Air cavity package for a semiconductor die and methods of forming the air cavity package | Electricity | 5 | Active |
| US8153480B2 | Air cavity package for flip-chip | Electricity | 4 | Active |
| US9066926B2 | Method of reducing exercise-induced joint pain in non-arthritic mammals | Human Necessities | 2 | Active |
| US7514801B2 | Electronic device and method of manufacturing thereof | Electricity | 1 | Expired |
| US9863585B2 | Light source assembly and method for producing the same | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US9691959B2 | Light emitting device package | Electricity | 1 | Active |
| US7989934B2 | Carrier for bonding a semiconductor chip onto and a method of contracting a semiconductor chip to a carrier | Electricity | 0 | Active |
| US10475973B2 | Light emitting device package | Electricity | 0 | Active |
| US7858444B2 | Electronic device and method of manufacturing thereof | Electricity | 0 | Active |
| US8070971B2 | Etch method | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.