Mounting apparatus
US10477697B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 3, 2017 |
| Grant date | Nov 12, 2019 |
| Priority date | — |
| Expiry date | Aug 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/759
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A mounting apparatus includes a Y-axis movable base 36 movable in a Y-axis direction, a Z-axis movable base 40 attached to the Y-axis movable base 36 and movable in a Z-axis direction, a mounting head 12 attached to the Z-axis movable base 40 and including a mounting tool 16 for sucking and holding a semiconductor chip, a pressurizing mechanism 20 attached to the Y-axis movable base 36 and arranged to apply a force in the Z-axis direction to the mounting head 12, and a pressure receiving member 22 provided independently of the Y-axis and Z-axis movable bases 36 and 40 and installed in proximity to the pressurizing mechanism 20 to receive a reaction force in the Z-axis direction from the pressurizing mechanism 20, the pressurizing mechanism 20 slidable on the pressure receiving member 22. This prevents the mounting apparatus from being increased in the total size while maintaining the mounting accuracy high.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.